Rain Tree Photonics Unveils 200G/Lane PIC Product Family and Advancements in 400G/Lane IMDD for Future AI Connectivity

Rain Tree Photonics (RTP), a leading innovator in silicon photonics, is proud to announce the availability of its 200G/lane Photonic Integrated Circuit (PIC) product family, designed to meet the increasing bandwidth and efficiency demands of AI clusters and hyperscale data centers.

The 200G/lane PIC product family leverages the RAIN-200 (Rain Tree Photonics Artificial Intelligence INterconnect 200G/lane) technology platform, which builds upon RTP's proprietary industry-leading silicon photonics technology to provide superior performance and scalability. Currently, 200G/lane PICs for 800G-DR4 and 1.6T-DR8 are sampling, with 800G-2xFR2 and 1.6T-2xFR4 expected to launch in the latter half of 2025. Besides the current 200G/lane product lineup, the company has also successfully delivered 100G/lane products in volume, including 400G-DR4 and 800G-DR8 on the 100G/lane generation of this platform. The RAIN-200 platform features high-bandwidth Germanium photodetectors and Silicon Mach-Zehnder modulators with best-in-class optical loss, bandwidth, and efficiency. Additionally, the platform includes ultra-low-loss waveguide and passive device technology, enabling 1x8 laser splitting use cases. Advanced packaging options further enhance seamless electronic-photonic integration, optimizing performance for next-generation optical transceivers. The platform also offers exceptional flexibility to address the increasing complexity and diversity of network requirements.

RTP has also achieved notable advancements in 400G/lane IMDD (Intensity Modulation Direct-Detection) and coherent-lite technology development for further scaleup, alongside successful Co-Packaged Optics (CPO) platform demonstrations utilizing advanced packaging, ensuring future readiness for AI and cloud computing needs. The company continues to push the boundaries of silicon photonics with its scalable, high-performance solutions designed for next-generation optical connectivity. RTP will unveil results of silicon modulators operating at 400G/lane IMDD at the IEEE Silicon Photonics Conference 2025 (London, England) on April 15^th.

About Rain Tree Photonics

Rain Tree Photonics (RTP) is a Silicon Photonics chipmaker dedicated to transforming next-generation optical interconnects through cutting-edge, scalable, and energy-efficient solutions. Specializing in high-performance optical connectivity for AI clusters, cloud computing, and hyperscale data centers, RTP’s innovations address the critical demands of bandwidth scalability, power efficiency, and cost-effectiveness in modern data infrastructure.

Leveraging deep Silicon Photonics expertise, RTP employs a Design for Manufacturability (DFM) approach and operates on a fabless++ business model, integrating a multi-source, fully optimized supply chain across foundry, testing, and packaging. To ensure seamless interoperability and optimized performance, RTP actively collaborates with leading electronic IC chipmakers in joint testing and validation, fine-tuning its solutions to meet evolving industry requirements.

Founded as a spin-off from IME, A*STAR, RTP is backed by leading venture capital firms and driven by a team of Silicon Photonics pioneers, industry veterans, and top-tier PhD researchers. Headquartered in Singapore, with a growing presence in China, RTP remains at the forefront of the industry, continuously advancing the boundaries of photonic integration to power the next wave of AI-driven optical networking solutions.

For more information, please visit www.raintreephotonics.com.

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